IEEE WINTECHCON 2023 

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The fourth edition of IEEE WINTECHCON 2023 organized by IEEE Bangalore Section, IEEE CAS Bangalore Chapter, WIE AG Bangalore Section is being held on September 21, 2023, at Leela Palace, Bengaluru as a physical event.

Theme: Emerging Technologies from Silicon to Software for a Sustainable Future.

About The Conference

WINTECHCON (Women in Technology Conference) is a technical forum for women leaders across the world to present their work in emerging areas. The conference is managed by senior women technologists from leading companies across the world in the space of semiconductors and electronic systems. The last edition of the conference, WinTechCon 2022, successfully brought 500+ senior women technologists under one platform focusing on deep technology work in both silicon design & system software domains.

This year the conference goes in-person and has lined up exciting Keynotes, peer-reviewed Technical Paper Presentations, Embedded tutorials, Exhibit booths, and Panel discussions.

Papers selected for presentation will have the opportunity to be published as IEEE proceedings.

The conference will focus on architecture, algorithm, design, IP, verification, implementation, test, reliability and safety in software, hardware and systems aspects of the following technology areas and their adjacencies. Papers, tutorials, and project demos are being sought in each of these areas.

• Artificial Intelligence/Machine Learning - Neural Networks, Deep Learning, Data Analytics, Big Data (Applications with model tuning, algorithms and optimization), AI-Enabled Systems, Accelerators (software/hardware).
• Compute at Scale - Hyperscale, Cloud, Cognitive, Mobile, Edge, Quantum, Virtualization, Service Mesh, Microservices, Heterogenous Architecture, Cloud Scale Workload Optimizations.
• Communication - Wireless, Networking (WAN, LAN, Mobile, 5G, Wi-Fi 6E, MIMO, MM wave, Antenna, RF, photonics), Wired (Data centre) networking, trends in Ethernet, Switching, Sensor networking, Mobile devices, connectivity.
• VLSI, IC Manufacturing and Fabrication.
• Electronic Design Automation (compilers, modelling, tools).
• IoT - Industrial 4.0, Digital Healthcare, Wearables, Smart cities, Decentralized Security, Sensor design.
• User Experience – Multimedia, Camera, Display, Video, Voice, Gaming and Music.
• Automotive - Radar, ADAS, Safety, Battery Management, Electrification, Cabin Infotainment, Connectivity, Human Machine Interface, Vehicle to Everything, Vehicle Analytics
• Security and Privacy - Cyber Security, Cryptography, Hardware, and Software Trusted Management.
• Compute for Social Good - Sustainable/Green Compute, Net Zero.
• Application, Architectural and Optimizing Inventions in Quantum Computing, Blockchain, Distributed Ledger.
• Augmented Reality (AR) / Virtual Reality (VR) Technologies.
• Advancement in Location/Navigation Product Based Technologies.
• Consumer Electronics.
• Robotics.

Please visit the conference website "Call for Papers" for more details: https://wintechcon.com/

Authors are invited to submit the full paper (Maximum 6 pages, double-column A4) as PDF within a limit of 6 A4 sheets in a double-column format and 10-point font, which is IEEE conference format, including figures and tables. Please click here to upload the paper in PDF format before 17th April 2023, May 1,2023. 

The primary author/presenter of the paper must be a FEMALE. Co-authors/co-presenters can be a MALE or FEMALE. Professionals from the technology industry (semiconductor/hardware/software) and academic may submit.

Conference Timeline:
Last Date of Paper Submission: April 17, 2023 Extended: May 15, 2023
Paper Acceptance Notification: July 28, 2023

We request you to give wide publicity for the conference among your faculty colleagues, students, researchers, and industry professionals.

Please contact us through email, contact@wintechcon.com, if you have any queries.