Call for Paper & Reviewers - IEEE TEMSCON ASPAC conference - BALI, 25-27 Sep 2024



The 2024 IEEE TEMS Conference Asia Pacific (TEMSCON ASPAC 2024) is a flagship conference of the IEEE Technology and Engineering Management Society. TEMSCON focuses on the cutting-edge development and practices of technology and engineering management in current business environments. This year, TEMSCON ASPAC 2024 raises a theme of "Achieving Competitiveness in The Age of AI". The rapid development of AI has been impacting business practices and society. This event brings together scholars and experts from Asia-Pacific and beyond. It includes an industry forum where industry leaders share insights on the trend, impacts, opportunities, and challenges of AI technology in enhancing global business competitiveness. 


📅 Dates: Sep 25-27, 2024
📍 Venue: Prama Sanur Beach Hotel, Bali, Indonesia
🌐 Website:

🔗 LinkedIn:


We invite contributions from scholars, practitioners, researchers, innovators, and entrepreneurs in advancing the understanding and the state of practice related to successful technology and engineering management. Contribution may take the form of academic research or practice-focused papers. We welcome submission in following major topics but not limited to: 

  • AI and Competitiveness
  • Technology for Sustainable Manufacturing, Logistics, and Supply Chain 
  • Cybersecurity Policies and Processes
  • Digital Healthcare Systems
  • Innovative Business Models for Startups
  • Business and Strategic Analytics
  • People and Leadership Practices in AI Era 
  • Managing Software Ecosystem 
  • Entrepreneurship and Digital Ecosystem
  • Technology and Innovation Management
  • AI Practices in Education and Training
  • Socioeconomic Impacts



We have lined up interactive conference activities, including:

  • Captivating keynotes and an industry forum themed "Achieving Competitiveness in the Age of AI"
  • Networking opportunities with IEEE TEMS global leaders (
  • Engage with Guest Editors in a pre-conference workshop to explore publication opportunities for Special Issues in IEEE Transactions on Engineering Management
  • Optional Bali tour package at an attractive rate


 Follow our LinkedIn page for upcoming updates!!



We invite you to volunteer or recommend qualified experts in your network to contribute to the review process. Your expertise and insights are invaluable in ensuring the quality and relevance of submitted papers. To volunteer or recommend reviewers, please fill out the form here  (



We are glad to highlight the previous Editions of 2022 and 2023 listed in IEEEXplore & Indexed in Scopus:
[1] 2022 IEEE TEMSCON ASPAC-Bangkok:                                              

[2] 2023 IEEE TEMSCON ASPAC-Bangalore:

Submit your papers now to 2024 IEEE TEMSCON ASPAC-Bali. Accepted and presented papers will be submitted for possible inclusion in IEEEXplore too!



Journal Information

  • IEEE Transactions on Engineering Management (IEEE-TEM)
  • Published quarterly since 1954
  • Scopus SJR : Q1, WoS IF: 5.8       


IEEE TEMS Publications encourages authors of conference papers to submit extended versions of their work to IEEE-TEM. We are pleased to invite authors of presented papers at 2024 IEEE TEMSCON-ASPAC BALI to submit their extended papers. We also welcome direct submissions to a Special Issue in IEEE-TEM, "Technology and Engineering Management for Sustainable and Competitive Societies in the Age of AI".                                                  

Find out more at



  • Full Paper Submission Date : 25 June 2024                                                                                    
  • Notifications of Acceptance Date : 30 July 2024                                                                                    
  • Camera Ready Submission Date : 25 Aug 2024                                                                                           
  • Early bird : 5 Aug  2024


Network with global leaders, engage in insightful sessions, and enjoy the perfect blend of professional development & the serene beauty of Bali. Submit your papers now and be part of this extraordinary experience!

2024 IEEE TEMSCON ASPAC Organizing Committee

🌐 Website:

🔗 LinkedIn:


View / Download the 2024 TEMSCON ASPAC at:


Any queries, Kindly contact,

Technical Program Chair

Noorlizawati Abd Rahim,

Nani Kurniati,


Publication Chair

M Devanathan,

Niniet Indah Arvitrida,


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