WinTechCon is IEEE

 ear Author,

On behalf of IEEE Wintechcon 2025 organizing committee, we hereby invite you to participate in this enriching 6th IEEE International Women in Technology conference, #WinTechCon2025, to be held on 12th-13th Nov 2025.  WinTechCon is IEEE only technical conference by and for women in engineering and is committed to providing a platform for showcasing high quality technical contributions made by women technology leaders in industry and in academia. It focuses on the latest advancements in VLSI, Embedded Systems, and software, attended by over 700+ engineers, students, faculty, industry, academia, and researchers.

 

Samsung Semiconductor India, Bangalore is proud to host this 6th edition of IEEE WINTECHCON 2025 in partnership with IEEE CAS, IEEE Bangalore Section, and IEEE WIE.

 

"Transforming the Future with Data-Driven Innovations in the Semicon-Verse".

 

Semicon-Verse, a riveting fusion of "semiconductors" and "universe," suggests a dynamic landscape where the Data-driven technological advances, with AI-ML at core, blur the boundaries of technology and imagination. In this ever-expanding realm, digital twins are developed by intertwining AL-ML with IoT and HBM, to create informative, predictive and comprehensive models that improves, enhances and innovates productivity and maintainability of the product. Advances in field of sensor, communication technology, automotive safety is redefining the mobility. Enhancements in Cybersecurity measures ensuring safeguarding the digital frontiers. Innovation today knows no bound and future is getting shaped by seamless integration of cutting-edge technologies.

 

Authors are invited to submit your original unpublished research work through the to Microsoft CMT tool under following technical tracks.

Track 1: VLSI Design, Circuits and Architecture

Track 2: AI Accelerators and Custom Hardware

Track 3: Embedded Systems, Real Time Computing, and Automotive Electronics.

Track 4: Security and Reliability in Semiconductor Design

Track 5: Communication, Connectivity, Multi-media and Digital Twins for Next Gen Systems

Track 6: Design Verification and Validation

Track 7: Semiconductor Packaging, Integration and System Design

Submission link: https://cmt3.research.microsoft.com/WINTECHCON2025/Submission/Index

All the accepted and presented papers will be submitted to IEEE Xplore for possible publication, ensuring quality, global visibility and recognition.

 

Full Paper/Tutorial/Demo Submission - June 23rd, 2025, 12:00PM IST – Hard Deadline

Notification of Acceptance                     - 16th Sep 2025

Conference Dates                                     - 12th and 13th Nov 2025

 

For more detailed information about technical tracks, submission guidelines etc, please visit conference website IEEE WINTECHCON 2025. For queries reach out to us on email: wintechcon2025@samsung.com

 

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