IEEE 35th Asian Test Symposium (ATS 2026)

 

Dear Colleagues and Researchers,

 

The ATS 2026 Organizing Committee cordially invites you to submit your original, unpublished papers to the IEEE 35th Asian Test Symposium (ATS 2026).

 

As a premier international forum in the field of electronics testing, ATS 2026 serves as a pivotal platform for academic researchers and industry professionals from around the globe to share groundbreaking ideas and present the latest research findings.

 

Call for Submissions

We invite submissions covering all aspects of system, module, and device testing, as well as broader test technologies. Topics of interest include, but are not limited to:

 

  • AI test and Test for AI
  • Analog/Mixed-Signal Test
  • Automatic Test Pattern Generation (ATPG)
  • Built-In Self-Test (BIST)
  • Design for Testability (DFT)
  • Fault Diagnosis and Failure Analysis
  • Machine Learning in Test
  • Memory Test, Diagnosis, and Repair
  • Hardware Oriented Security and Trust
  • SiP, Chiplet, 2.5D and 3D IC Test
  • Yield Analysis, Learning, and Enhancement

(For a comprehensive list of topics, please visit our website https://www.ats2026.tw/ )

 

Submission Guidelines:

  • Submissions must be made electronically via PDF manuscripts only.
  • Papers must not exceed 6 pages in standard IEEE 2-column format (including abstract, figures, tables, and bibliography).
  • Accepted papers will be submitted for inclusion into IEEE Xplore.
  • Note: At least one author registration (full rate) and attendance at the conference is required for each accepted paper to make the presentation.

 

Important Dates:

  • Paper Submission Deadline: June 6, 2026 (23:59 AoE, Anywhere on Earth)
  • Notification of Acceptance: September 14, 2026
  • Camera-Ready Manuscript: October 13, 2026

 

Learn More about the Program: For complete submission guidelines, online submission portals, and registration updates, please visit: https://www.ats2026.tw/

 

Conference Contact Email:
Name: Mr. Yung-Ming Chiu
ATS 2026 Organizing Committee Email: pobsadue@poetry-life.com

 

We look forward to receiving your contributions and welcoming you to Kaohsiung!

 

The ATS 2026 Organizing Committee invites original, unpublished paper submissions on the topics listed below. Regular paper submissions should be made electronically by PDF manuscripts only, not exceeding 6 pages in IEEE 2-column format (including abstract, figures, tables, and bibliography). A submission will be considered evidence that upon acceptance, at least one author will attend the conference to make the presentation. Authors of accepted papers are responsible for preparing the final manuscripts in time to be included in the electronic proceedings. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore's scope and quality requirements. At least one author registration (full rate) to the conference is required for each accepted paper. More information is available from the following link: Submission Guidelines.

 

  • AI test and Test for AI
  • Analog/Mixed-Signal Test
  • ATE Design
  • Automatic Test Pattern Generation (ATPG)
  • Autonomous Testing
  • Board-Level Testing and Diagnosis
  • Boundary Scan Test
  • Built-In Self-Test (BIST)
  • CPU/GPU Test
  • Connectivity Testing
  • Defect-Based Test
  • Delay and Performance Test
  • Dependability and Functional Safety
  • Design Verification, Validation, and Debug
  • Design for Testability (DFT)
  • Diagnosis and Silicon Debug
  • Fault Diagnosis and Failure Analysis
  • Fault Modeling and Simulation
  • Fault Tolerance
  • Hardware Oriented Security and Trust
  • High-Speed I/O Test
  • Heterogeneous Testing
  • Low-Power IC Test
  • Machine Learning in Test
  • Memory Test, Diagnosis, and Repair
  • Multi-/Many-core Processor Test
  • Online Test
  • On-Chip Measurement
  • Power/Thermal/Reliability Issues in Test
  • Reconfigurable System Test
  • Reliability and Testing for Emerging/Approximate/Quantum Computing
  • RF Test
  • Safety and Test for Automotive ICs
  • Self-Repair
  • SiP, Chiplet, 2.5D and 3D IC Test
  • Software Test and Reliability
  • Standards in Test
  • System-on-Chip Test
  • Test Compression
  • Test Economics
  • Test Quality
  • Test Synthesis
  • Test for Biomedical Circuits and Systems
  • Test for MEMS and Microfluidic Systems
  • Test for Nanoscale Devices and Emerging Technologies
  • Test for Reversible and Quantum Circuits
  • Test for Sensors and IoT
  • Yield Analysis, Learning, and Enhancement
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