IEEE Bangalore Technology Conclave (BTC)

 

Dear Members,

Greetings from the IEEE Bangalore Section!

IEEE Bangalore Technology Conclave (BTC) is a flagship annual conclave of IEEE Bangalore Section. It is a premier industry forum dedicated to the Future of Technology and Sustainable technological advancement. The conclave catalyzes collaboration between industry and research communities, featuring high-quality, industry-focused research papers and presentations by leading researchers, practitioners, and technologists. Plenary talks complement it, panel discussions, thought leadership forums, and other sessions. The current 7^th edition of this flagship program of the IEEE Bangalore Section will focus on Sustainable AI through the Co-design of Systems and Software, exploring how unified hardware-software approaches can unlock optimized performance, resource efficiency, and scalable deployment.

This edition will feature two technical tracks: Industry Research Track (Proceedings) and Industry Presentation Track (Non-Proceedings). The Industry Research Track will provide a platform for industry personnel to submit short papers to IEEE on leading technologies aligned with the theme of the conclave. IEEE guidelines will peer review these papers and submit them for consideration for publication in IEEE Xplore. The Industry Presentation Track will feature only selected presentations from leading experts on various technologies. The presentations will be reviewed thoroughly, and these will not be submitted to the IEEE Xplore platform.

The conclave cordially invites researchers, industry experts, and leading practitioners to submit their original, unpublished contributions as papers and presentations for both proceeding and non-proceeding tracks.

 

Important Dates:

Submission Opens: April 05, 2026

Submission Deadline (Industry Research Track): Jun 14, 2026

Submission Deadline (Industry Presentation Track): July 14, 2026

Notification of Acceptance (Industry Research Track): Aug 08, 2026

Notification of Acceptance (Industry Presentation Track): Aug 15, 2026

Camera-Ready Submission (Both Tracks): Aug 30, 2026

Registration Deadline (Both Tracks): Sept 01, 2026

 

Conference Date: Sept 24 - 25, 2026

Website: https://btc-2026.ieeebangalore.org/

 Venue: Chancery Pavilion, Residency Road, Bengaluru, India

   

Topics of Interest

 

1.   System-level Design and Architecture

2.   Application-specific System and Use cases

3.   Modelling, Simulation, Validation, and Verification

4.   Embedded and Cyber Physical Software

5.   Safety, Security, and Reliability

6.   Intelligent Power Electronics Systems

7.   Emerging Technologies

 

Submission Guidelines

Who Should Submit

Industry Professionals, Academic Researchers who are doing collaborative research with industry

Key Benefits of Participation

Visibility across the industry, Opportunity to showcase to 200+ participants from leading industries.

Submission Tracks

1.   Industry Research Track (Proceedings)
This track is designed for authors who wish to publish their work in formal and Archival publications. The submission in this track will undergo a thorough peer-review process, and accepted papers will be submitted to IEEE Xplore for possible inclusion.

2.   Industry Presentation Track (Non-Proceedings)

This track is designed for authors who wish to present their early-stage research, industry insights, and position papers. The submissions in this track will be peer-reviewed for relevance and quality. Accepted contributions will be presented at the conclave via talks or posters, but will not be submitted to IEEE Xplore.

With Best Regards,

BTC 2026 Organizing Committee

IEEE Bangalore Section

 

Topics of Interest

System-level Design & Architecture

• End-to-End System Design
• Hardware-Software Co-Design
• Architecture Design
• Cyber-Physical System Design
• Model-based Design
• Design Automation
• Processor & Memory Architecture
• Interconnect & Networking Systems
• Multiprocessor Systems
• Microservices, Event-Driven, Self-adaptive & P2P Architecture

Application-specific Systems & Use Cases

• Custom Silicon Design
• IP Core Design
• SoC for Specific Applications
• Supercomputer & Cluster Computing Systems
• IoT & Medical Device Design
• Consumer Electronics & Wearables
• Cyber-Physical Systems
• Avionics & Automotive Systems

Modeling, Simulation, Validation & Verification

• System Modelling & Simulation
• Hybrid System Modelling
• Transaction-level Modeling (TLM)
• Event-driven & Mixed-signal Simulation
• FPGA-based Emulation & Virtual Prototyping
• Formal Verification & Post-Silicon Verification
• Power, Thermal & Timing Simulation
• Benchmarks

Embedded & Cyber Physical Software

• Real-Time Operating Systems (RTOS)
• Embedded C/C++ Programming
• Device Driver Development
• Middleware and Frameworks
• Embedded Systems Security
• Automotive & Industrial Embedded Systems

Safety, Security & Reliability

• Functional Safety & Risk Assessment
• Safety Standards and Compliance
• Threat Modeling & Secure Coding
• Security Testing and Validation
• Fault Tolerance & Redundancy
• Cross-layer Reliability
• Security for Embedded, CPS & IoT

Intelligent Power Electronics Systems

• Power Converter Control
• Power Quality and Grid Stability
• Efficiency Optimization
• Smart Grids and Microgrids
• Electric Vehicle (EV)
• Renewable Energy Integration
• Intelligent Energy Management

Emerging Technologies

• Quantum Technologies
• Digital Twins
• Humanoids
• Augmented Realities
• Neuro-Morphic Computing
• Smart Healthcare