TEMSCON-ASPAC
2026 IEEE Technology & Engineering Management Conference - Asia Pacific (TEMSCON-ASPAC)
October 16,17, 2026
Rajkot, India, Gujarat
https://2026.aspac-temscon.
Dear Distinguished Colleagues, Precious Academicians and Research Professionals,
We are pleased to inform you that the 5th IEEE Technology and Engineering Management Society Conference: Asia-Pacific (TEMSCON-ASPAC 2026) will
be held on October 16-17, 2026 in Rajkot, Gujarat, India. It is our
immense pleasure to invite you to submit your research paper.
The 2026 IEEE Technology and Engineering Management Society (TEMS) Conference Asia Pacific — TEMSCON-ASPAC 2026 (Conference Record #69489)
is a flagship conference of the IEEE Technology and Engineering
Management Society. TEMSCON continues to highlight cutting-edge
developments and practices of technology and innovation management in
today’s rapidly evolving business and societal environments. In 2026,
TEMSCON-ASPAC adopts the theme: “Strategic Management of
Autonomous & Intelligent Systems: Convergence, Security, Innovation,
Sustainability, and Talent Development in Critical Sectors.” Hosted at Marwadi University, Rajkot, Gujarat, India, on 16-17 October, 2026, the conference brings together scholars, practitioners, innovators, and industry leaders from across Asia-Pacific and beyond.
The program includes keynote addresses, research paper presentations, an Industry Forum,
and discussions on the opportunities and challenges of deploying
intelligent systems in healthcare, defence, aerospace, smart
manufacturing, and Industry 5.0.
For more details, please visit the conference website: https://2026.aspac-
* Topics
Topics of interest include, but are not limited to:
Track 1: Autonomous & Intelligent Systems
Track 2: Digital Transformation & Industry 4.0/5.0
Track 3: IoT, Cyber-Physical Systems & Smart Infrastructure Topics
Track 4: Digital Twins, Simulation & Systems Engineering
Track 5: Secure cloud, Cybersecurity, Blockchain & Trusted Digital Systems
Track 6: Smart Manufacturing & Advanced Production Systems
Track 7: Technology & Innovation Management
Track 8: Business Analytics, Forecasting & Decision Intelligence
Track 9: Supply Chain, Logistics & Operations Management
Track 10: Project, Program & Infrastructure Management
Track 11: Entrepreneurship, Startups & Technology Commercialization
Track 12: Strategic Management & Digital Business Transformation
Track 13: People, Leadership & Societal Impact of Technology
Special Track: AI Synergy: Unifying Healthcare and AgriTech for a Sustainable Future
* Important Dates:
- Full Paper Submission(Hard Deadline): 30 May 2026
- Notification of Acceptance: 30 June 2026
-Camera-Ready Submission: 15 August 2026
-Conference Date: 16-17 October 2026
-Early Bird Registration: 30 July 2026
Paper Submissions
Please prepare your full paper according to the IEEE Templates (https://www.ieee.org/
Each
accepted paper requires at least one full registration. The submitted
papers must not be previously published anywhere and must not be under
consideration by any other conference or journal during the TEMSCON
ASPAC review process.
* Paper Publication
Accepted
papers will be submitted for inclusion into IEEE Xplore subject to
meeting IEEE Xplore’s scope and quality requirements. A number of
selected high-impact full text papers will be invited to extend and
considered for SCI-indexed or EI-indexed journals.
* Technical Sponsored by: IEEE TEMS Society.
* Organized by: Marwadi University, Rajkot, Gujarat, India.
*Previous Conference
2022
TEMSCON ASPAC was successfully held in Bangkok, Thailan, bringing
together the world's top experts, scholars, and outstanding talents in
the industry. They conducted open discussions on hot topics, core
technologies, and industrial research issues. 2023 TEMSCON ASPAC was
held at Bengaluru, India, 2024 TEMSCON ASPAC at Bali, Indonesia and
2025 TEMSCON ASPAC was successfully organized at Bangkok, Thailand
Please feel free to circulate this message among your friends.
We would like to send our greetings and look forward to seeing you!
Best regards
Organizing Committee
2026 IEEE Technology & Engineering Management Conference - Asia Pacific (TEMSCON-ASPAC)
Email: temscon.aspac@gmail.com
Web site: https://2026.aspac-
Guidelines for Authors
We invite engineering leaders, researchers, educators, innovators, entrepreneurs, and students to submit their original manuscripts to TEMSCON-ASPAC 2026. Contributions may take the form of academic research or practice-focused papers to help advance the understanding and the state of practice related to successful technology and engineering management.
Accepted and presented papers will be included in the IEEE Xplore online digital library. Authors must follow the guidelines below for paper acceptance.
1. Paper Submission Guidelines
- Language: All papers are required to be in the English language.
- Originality: Papers submitted to ASPAC TEMSCON 2026 shall contain original work by the author(s) that have not been published or submitted for publication elsewhere.
- Plagiarism Policy: The IEEE anti-plagiarism policy is applicable to all submissions. Similarity will be checked and will be evaluated acoording to the IEEE Conference Policy.
- AI Disclosure: Use of content generated by artificial intelligence (AI) in an article (including text, figures, images, and code) must be disclosed in the acknowledgments section. The AI system and specific sections used must be identified. (Standard grammar and editing tools are generally exempt).
- Template: Authors are required to use the IEEE Standard manuscript template (A4 size, two-column format). Download Templates here.
- Page Limit: The paper must be a minimum of 4 pages and maximum of 8 pages in length, including diagrams, pictures, and references.
- Format: The papers must be uploaded in PDF format.
2. Double-Blind Review Guidelines
To ensure a fair and objective peer-review process, TEMSCON-ASPAC 2026 employs a double-blind review strategy. Your initial submission PDF must be anonymized:
- Anonymization: Do not include author names, affiliations, or email addresses anywhere in the manuscript PDF.
- Acknowledgments: Omit any acknowledgments of funding or assistance in the initial review version.
- Self-Citing: When citing your own previous work, do so in the third person (e.g., "In [5], Smith et al. demonstrated..." rather than "In our previous study [5]...").
- Metadata: Ensure that the PDF file properties/metadata do not contain author names.
3. Submission Process via EDAS
All papers must be submitted electronically through the EDAS system. Submissions via email will not be accepted.
- Login/Register: Create or log into your account at EDAS.info
- Register Paper: Select the TEMSCON-ASPAC 2026 conference and enter your paper's title and abstract.
- EDAS Link for Conference: https://edas.info/newPaper.php?c=35022
- Add Authors: List all co-authors in the EDAS system. Note that while they are listed in the system, they must remain absent from the uploaded PDF.
- Upload: Upload your anonymized PDF. EDAS will perform automated checks for margin and font compliance.
Detailed Instructions: For technical help with the submission portal, please refer to: EDAS: Instructions for Authors.
4. Review and Acceptance
- All papers will be peer-reviewed by the technical committee.
- Acceptance is based on the condition that at least one author will register and present the paper at the conference.
- IEEE reserves the right to exclude a paper from distribution (IEEE Xplore) if the paper is not presented at the conference ("No-Show Policy").
5. Presentation Guidelines
- Presentations must be in English and should use the official ASPAC TEMSCON 2026 Cover Template.
- Authors should submit their PPT files to the designated conference folder prior to the session.
- Presentations should not exceed 12 to 15 minutes, followed by 3 to 5 minutes for Q&A.
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