IEEE TEMSCON ASPAC
CALL FOR PAPERS
The 2025 IEEE TEMS Conference Asia Pacific (TEMSCON ASPAC 2025) is a flagship conference of the IEEE Technology and Engineering Management Society. TEMSCON focuses on the cutting-edge development and practices of technology and engineering management in the current business environments. This year, TEMSCON ASPAC 2025 raises a theme of "Achieving Competitiveness in The Age of AI and Big Data Analytics". The rapid development of AI and Big Data Analytics have been impacting business practices and society. This event brings together scholars and experts from Asia-Pacific and beyond. It includes an Industry Forum where industry leaders share insights on the trend, impacts, opportunities, and challenges of AI technology in enhancing global business competitiveness.
IEEE TEMSCON ASPAC-BANGKOK 2025
Dates: Sep 14-16, 2025
Venue: Asawin Grand Convention Hotel, Bangkok, Thailand
Website: 2025.aspac-temscon.
LinkedIn: https://www.
We invite contributions from scholars, practitioners, researchers, innovators, and entrepreneurs in advancing the understanding and the state of practice related to successful technology and engineering management. Contribution may take the form of academic research or practice-focused papers. We welcome submission on the following major topics but not limited to:
Track 1: AI, Machine Learning & Software Engineering
- AI in Global Market Competitiveness
- AI Practices in Education and Training
- AI and Software Engineering
- Machine Learning Technology for IoT
- Managing Software Ecosystem
Track 2: Big Data, Analytics & Digital Transformation
- Big Data Analytics in Industry
- Challenges in Big Data Analytics for Business and Industry
- Strategic Decision-Making with Business Analytics
- Digital Transformation and Innovation
- Intelligent Knowledge Systems for Decision Support
Track 3: Technology, Cybersecurity and Industry Applications
- Technology for Sustainable Manufacturing, Logistics, and Supply Chain
- Cybersecurity Policies and Processes
- Digital Healthcare Systems
- IoT or CPS Applications and Use Cases
- Technology and Innovation Management
Track 4: Entrepreneurship, Business Models and SocioEconomic Impacts
- Innovative Business Models for Startups
- People and Leadership Practices in AI Era
- Entrepreneurship and Digital Ecosystem
- Socioeconomic Impact of Emerging Technologies
- Knowledge in Business and Organizational Growth
Submission Guidelines
Prospective authors are invited to submit full papers (4–6 pages) via the Microsoft's Conference Management Toolkit submission system. All accepted papers will be published in the conference proceedings and submitted for inclusion in IEEE Xplore.
Submit Your Paper Today: https://cmt3.research.
SPECIAL HIGHLIGHTS
We have lined up interactive conference activities, including:
- Captivating keynotes and an industry forum themed "Achieving Competitiveness in The Age of AI and Big Data Analytics "
- Networking opportunities with IEEE TEMS global leaders
- Explore publication opportunities for Special Issues in IEEE System Journal
- Optional Bangkok tour package at an attractive rate
Follow our LinkedIn page for upcoming updates!!
CALL FOR REVIEWERS
We invite you to volunteer or recommend qualified experts in your network to contribute to the review process. Your expertise and insights are invaluable in ensuring the quality and relevance of submitted papers. To volunteer or recommend reviewers, please fill out the form. (https://lnkd.in/gBtJa6zU)
PUBLICATIONS
We are glad to highlight the previous Editions of 2022 and 2023 listed in IEEEXplore & Indexed in Scopus:
[1] 2022 IEEE TEMSCON ASPAC Bangkok: https://ieeexplore.
[2] 2023 IEEE TEMSCON ASPAC-Bangalore: https://
Submit your papers now to 2025 IEEE TEMSCON ASPAC-Bangkok. Accepted and presented papers will be submitted for possible inclusion in IEEEXplore too!
TEMSCON Special Issue Opportunity in IEEE System Journal
Journal Information
- IEEE Systems Journal
- Published quarterly since 2007
- (Scopus SJR : Q1)
This special issue is in collaboration with 2025 Technology and Engineering Management Society Conference TEMSCON-ASPAC held September 14-16, 2025, in Bangkok, Thailand. Authors of selected high-quality papers presented at the 4th International Conference of TEMSCON ASPAC 2025 will be invited to submit extended/revised versions of their papers, based on the comments that they will receive during the conference.
Find out more at https://2025.aspac-temscon.
IMPORTANT DATES
Full Paper Submission: 15 June 2025
Notifications of Acceptance: 31 May 2025
Camera Ready Submission: 30 June 2025
Early bird : 15 August 2025
Network with global leaders, engage in insightful sessions, and enjoy the perfect blend of professional development & the serene beauty of Bangkok, Thailand. Submit your papers now and be part of this extraordinary experience!
2025 IEEE TEMSCON ASPAC Organizing Committee
Any queries, Kindly contact,
Yamin Thwe
Email: temsconaspac2025@rmuttt.ac.th
We look forward to welcoming you to Bangkok, Thailand!
We invite engineering leaders, researchers, educators, innovators, entrepreneurs, and students to submit their original manuscripts to TEMSCON-ASPAC 2025. Contributions may take the form of academic research or practice-focused papers, to help advance the understanding and the state of practice related to successful technology and engineering management.
Accepted and Presented papers will be submitted for possible inclusion into IEEE Xplore®.
The author must follow the following guidelines for the paper acceptance.
Paper submission guidelines
- All papers are required to be in English language.
- Papers submitted to ASPAC TEMSCON 2025 shall contain original work by the author(s) that have not been published or submitted for publication. The IEEE anti-plagiarism policy is applicable to all submissions.
- Authors are requested to submit a copy of the Turnitin report or any other plagiarism detection tool report indicating a similarity index of less than 20% along with their manuscript during their initial submission for consideration in the review process
- Artificial intelligence (AI)–generated text: The use of content generated by artificial intelligence (AI) in an article (including but not limited to text, figures, images, and code) shall be disclosed in the acknowledgements section of any article submitted to an IEEE conference. The AI system used shall be identified, and specific sections of the article that use AI-generated content shall be identified and accompanied by a brief explanation regarding the level at which the AI system was used to generate the content. The use of AI systems for editing and grammar enhancement is common practice and, as such, is generally outside the intent of the above policy. In this case, disclosure as noted above is recommended.
- The authors are required to use IEEE Standard manuscript template for the conference. The manuscript template can be downloaded from IEEE conference template page.
- Authors are required to prepare and submit the papers in IEEE standard A4 size two-column conference format. The paper must be a maximum of 8 pages in length including diagrams, pictures and references.
- Choose one topic related to the paper. This information will be used by committee for assigning appropriate reviewers.
- The introduction of paper shall clearly indicate the unique aspect of submission.
- The papers must be uploaded in PDF format.
- Changes can be made even after submission till the deadline. No submissions will be accepted after the submission deadline.
Review and acceptance
- All papers will be peer reviewed.
- English shall be official language.
- Paper must not exceed 8 pages. Failing to do so may result in rejection.
- Acceptance is based on condition that at least one author will register and present the paper at conference. IEEE reserves rights to exclude a paper from distribution after the conference if the paper is not presented at the conference.
Presentation guidelines
- The presentation should be in English.
- Presentations should use ASPAC TEMSCON 2025 Cover Template <<download>>.
- Authors should submit their PPT file to this Google Drive Folder <<link>> before the presentation.
- Presentation discussion should be in English.
- Presentation should not exceed 12 to 15 minutes.
- 3 to 5 minutes will be given for Q&A.
Important note to authors
- In case of multiple authors for an accepted paper, at least one author is expected to attend the meeting.
- Registration fee must be paid within the due deadline. Late payment may result in the paper not being included in the conference program and any other publications that are produced for distribution at conference.
- Each paid fee covers one presentation and an additional registration fee applies for any extra presentation.
- Participation will be confirmed upon receipt of the online registration form and fee payment.
- Per ASPAC TEMSCON no show policy, the program chair reserves the right to exclude any unpresented papers from proceeding to IEEE Xplore©.
Contact
- temsconaspac2025@gmail.com
- Connect to our Linkedin Page for updated Information
LinkedIn: https://www.linkedin.com/in/
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